Duration:    2008-11-04 ~ 2008-11-06
Venue :    INTEX Shanghai (No. 88 Loushanguan Rd., Shanghai, China)

A conference focus on Packaging/Assembly/SMT
The conference will welcome speakers and delegates from electronic packaging, assembly and system intergration related industry to the most progressive trading platform in China
Quality, competence, and an intimate atmosphere for intensive networking are the conceptual ingredients of the China SMT Forum 2008.
The competence of internationally renowned speakers guarantees the high level of the China SMT Forum 2008.
The continuing fertile relationship with the Fraunhofer IZM, Berlin and further international institutions guarantees the presence of the most up-to-date technology at the China SMT Forum 2008.
Additionally an exclusive exhibition offers selected companies the opportunity to present their products to a highly qualified expert audience.

Conference Topic:
Lead-free implementation
PCB and Semiconductor Packaging
Assembly and Soldering
Reliability
Markets and Trends
(For more information, please contact organizer)